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Wafer Inspection System
Fortix PV Wafer Test, Inspection & Classification System can be used at the ending of Solar Wafer manufacturing process as a final inspection process and it also can be used in the beginning of Solar Cell manufacturing process as a incoming inspection process.

Depending on customers’ choice, various testing & inspection such as Resistivity & Thickness measurement and Geometry (top & bottom side), Micro-Crack , Saw mark inspection & side chipping inspection can be carried out in a fast mass production mode.

Solar wafers can be supplied into the system with many different modes like belt link, carrier cassette, stack magazine, etc… In order to achieve high productivity, wafers are transported and measured on-the-fly mode. Upon the results and users’ categorization, wafers are classified into different bins.

● UPH: 3,600
● PH: 3,600
● Mono crystalline & Multi crystalline wafer
● Breakage rate: less than 0.05%
● Wafer thickness: over 100um
Active Alignment System
Fortix has developed Active Alignment System, which collaborates multi axis of freedom active alignment with image data acquired by the image sensor of camera before camera assembly.
Fortix Active Alignment System guarantees the optimal lens position relative to the image sensor with high yield & high productivity.

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